100pcs/Lot 10mmx10mmx1mm GPU Northbridge IC LED Chipset Heatsink Cooling Conductive Silicone Thermal Pad,10x10x1mm with 3.2W/mK

Learn more about the Detailed Specifications Features Features Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface use for Control board, the motor, electronics, auto mechanics, computer host, laptops, DVD, VCD, LID, set-top boxes ,LED IC SMD DIP and any cooling module needs to be filled and materials for electrical and electronic products. Soft,good malleability,with a little viscosity. Strong insulation and Excellent performance. Provide a mess-free installation, maximum heat conduction and increased cooling. Reduce the effectiveness of your heatsink and raise the operating temperature of your processor/video card. Material: conduction silicone Thermal Conductivity: 3.2(W/M-K) Continuous Temperature: -40 Celsius degree~200 Celsius degree Breakdown Voltage: >4KV Tensile Strength: 180Kgf/cm2 Color: Blue Size:10 x 10 x 1.0 mm Package: 100pcs/bag Additional Information Date First Available November 06, 2018