QianLi i2C Middle Frame Reballing Platform for iPhone X - 11 Pro Max

Qianli i2C ZX-06 6 in 1 middle frame BGA reballing platform for iPhone X - 11 Pro Max motherboard soldering repair, QianLi ZX-06 middle frame reballing platform for iPhone X XS XS MAX 11 11 Pro 11 Pro Max separating repair, QianLi 6 in 1 iPhone middle board reballing planting platform for iPhone X XS MAX 11 Pro Max logic board dissembling and assembling testing toolQianli i2C ZX-06 6 in 1 Mid-level (Middle) Automatic Positioning Tin Planting Platform For iPhone X - 11 Pro Max Motherboard Soldering RepairProduct Features : Anti-leakage tin barrier design High temperature does not allow drum, Strong magnetic automatic positioning Integrated, removable tin planting, Positioning slot of double-sided motherboard Support with iPhone X / XS / XS MAX motherboard, RF small board iPhone 11 / 11 Pro / 11 Pro MAX positioning tin replanting application. Product Parameters : Item name: ZX-06 Reballing Middle Board Brand: i2C Color: Gray Weight: 270g Size: 101.5*52*16mm Applicable models: iPhone X / XS / XS MAX / 11 Pro MAX / 11 Pro Scope of application: iPhone Tin is planted in the middle of the main board Package included : 1pcs x ZX-06 Reballing Platform