Fanless Embedded System with Intel® Apollo Lake N3350 / N4200 Processor (up to 2.5 GHz)
Powerful Apollo Lake Processor N4200 (2M Cache, up to 2.5 Ghz, TDP 6W) N3350 (2M Cache, up to 2.4 Ghz, TDP 6W) 1.48X Performance Improvement(CPU Passmark) Power Consumption Reduction Lower Power Consumption Fanless ThermalDesign for Less Environmental Impact Support 3 Ports LAN and 2 w/ PoE+ options Total supports 3 x Giga LAN 2 x LAN supports 802.3af and 802.3at PoE Versatile Xpansion Modules Support HDMI + VGA, DVI, or DisplayPort Support power COM port &Digital I/O for iIoT application MS-01VGA-D10 VGA Port Expansion Module MS-01DVI-D10 DVI-D Port Expansion Module MS-01DPN-D10 DisplayPort Expansion Module MS-02COM-D10 Expansion Module with 2 x RS232 / 422 / 485 (support power 5V/12V) MS-08DIO-T10 Expansion Module with 8-bit Isolated DIDO (4 x DI, 4 x DO) Edge AI Accelerator Intel® Movidius™ Myriad™ X for Edge AI MB1-10AP with AI modules powered by Intel® Movidius™ Myriad™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation. Integrated thermal solution for total fanless desig Low Power Consumption Design Support Intel OpenVINO Toolkit Supported Framework:TensorFlow, Caffe, MXNET Support Flexible Configuration For Dual Display Support HDMI as primary display Support secondary display (DisplayPort, DVI-D, or VGA) with Xpansion module options Increase the flexibility to aim at target markets Advanced Power Protection Wide Power Range 8V~24V Power Protection Reverse Power Input Protection Over Voltage Protection: 30V Over Current Protection: 16.6A ESD Protection: +/-15kV (air), +/-8kV (contact) Surge Protection: 3kW -25~70oC Wide Temperature MB1-10AP is designed in patented aluminum enclosure not only for aesthetic appearance but also for fan-less application in extreme temperature condition from -25℃ to 70℃. Extreme Shock & Vibration Resistance Shock Resistance Operating, 50 Grms, Half-sine 11 ms Duration(w/ SSD, according to IEC60068-2-27) Vibration Resistance Operating, 5 Grms, 5-500 Hz, 3 Axes(w/ SSD, according to IEC60068-2-64) Clear Installation Design MB1-10AP (MB1-10AP) Specifications SYSTEM CPU Intel® Apollo Lake-M N4200 / N3350 Processor CHIPSET Intel® SoC Integrated SYSTEM MEMORY DDR3L 1866 MHz / 1 x 204-pin SO-DIMM / Max. 8GB (Non-ECC) GRAPHICS Intel® HD Graphics DISPLAY INTERFACE HDMI 1.4 / Optional DisplayPort/VGA/DVI-D by Expansion Module STORAGE SLOT 1 x 2.5 HDD / SSD (Default w/ HDD Bracket) / 1 x mSATA ETHERNET 2 x Intel® I210-IT Giga LAN (Optional 2 x Output PoE LAN support 802.3af and 802.3at. Maximum Power Budget 30W for dual port) / 1 x Realtek RTL8154 LAN (Up to 480Mbps) AUDIO Realtek® ALC662 / ALC888 I/O CHIPSET Nuvoton NCT6116D TPM Nuvoton NPCT750AAAYX TPM2.0 (Optional) EXPANSION SLOT LTE/Wireless: Mini PCIe Full size (USB / PCIe), w/ SIM Card Holder (w/ Full to Half size adapter plate) / Storage: mPCIe Full size (USB / PCIe / SATA) INTERNAL SPEAKER 1 x Buzzer INDICATOR Power Button / Power LED / HDD LED FRONT I/O 1 x HDMI 1.4 / 4 x USB 3.0 / 2 x SMA Antenna (Optional for WiFi/LTE function) / 1 x Xpansion Module Door / 2 x RS232 / 422 / 485 (Support Power 5V / 12V) REAR I/O 1 x 2-pin Header Remote Power on / off / 3 x RJ-45 / 1 x Mic-in / 1 x Line-out / 1 x 3-pin Terminal Block Power Input / 2 x SMA Antenna (Optional for WiFi/LTE function) WATCHDOG TIMER 1~255 steps by software program EDGE AI ENGINE (Optional) Single Movidius Myriad X VPU, and Intel® OpenVINO™ toolkit supported (Optional) POWER REQUIREMENT POWER INPUT 8~24V Wide Range DC Input w/ Terminal Block Connectivity POWER ADAPTER Optional ENVIRONMENTAL OPERATING TEMPERATURE -25°C to 70°C (For non-PoE SKU) / -25°C to 60°C (For PoE SKU) / with 0.7m/s Air Flow and Wide Temperature Memory/Storage STORAGE TEMPERATURE -40 ~ 85°C (-40 ~185°F) OPERATING HUMIDITY 10% ~ 90% R/H (Non-condensing) STORAGE HUMIDITY 10% ~ 95% @85°C non-condensing VIBRATION RESISTANCE Operating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64) SHOCK RESISTANCE Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) CERTIFICATION CE / FCC Class A MECHANICAL THERMAL DESIGN Fanless MOUNTING Wallmount / 75 mm x 75 mm VESA Holes & Din Rail Mount Combo Kit (Optional) DIMENSIONS (W X D X H) 6.9” x 4.1” x 2.2” (170 x 105 x 57 mm) WEIGHT 1.3kg (2.8 lb) MATERIAL Top cover: Aluminum Alloy / Bezel and chassis: Steel OS OS SUPPORT Windows® 10 64-bit / Linux (support by request) PACKING LIST PACKAGE 1 x Quick Installation Guide / 1 x Embedded System / 1 x Wall Mount Brackets / 1 x 3 pin Terminal Block Power Connector / 1 x Full to Half Size mPCIe Card Adapter Plate