TECu1-12710 Thermoelectric Peltier Chip Module Copper Substrate

TECu1-12710 - Superior efficiency & performance compared to 12705 (if used correctly) This is a specialized Peltier module with two unique features: Maximum attainable heat transfer with ultra thin copper plates instead of the traditional ceramic plates. Ultra thin 1.92mm overall module thickness compared to 3.2 - 3.9mm that is typical for 40*40mm modules. Even heat dissipation across the entire surface. Recommended for applications that need the most power and fastest thermal response in a compact package. This module must be handled very carefully. Because copper is a soft metal, be careful to not damage it, if bent, the module will fail.