Hydrosilex Cutting Compound 8oz

HydroSilex Cutting Compound is an advanced polishing solution designed for detailers seeking to achieve hologram-free results with exceptional depth of gloss. This medium cut and finish polish is formulated with diminishing abrasives, ensuring consistent breakdown during use. Ideal for dual-action and random orbital polishers, it promises a superior finish without the drawbacks of traditional compounds. Key Features: Diminishing Abrasives: Engineered to provide a medium cut while breaking down consistently for a smooth finish. Hologram-Free Results: Specifically formulated to eliminate holograms and produce a clear, reflective surface. Water-Based Formula: Contains no solvents, silicones, fillers, or petroleum, making it a safer choice for both users and the environment. Dust-Free Application: The unique formulation prevents dust production during polishing, ensuring easier cleanup and longer pad life. Versatile Use: Compatible with dual-action and random orbital polishers for op