Hydrosilex Cutting Compound 16oz

Hydrosilex cutting compound is the latest formulation of diminshing abrasives providing a medium cut & polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers, the abrasives break down very consistenly to produce the highest depth of gloss. Hydrosilex cutting compound is water-based and contains no solvents, silicones, fillers or petroleum. No dust is produced during polishing which makes for easy clean up and prolongs the life of the polishing pads.Recommended Use:Shake before use. Apply 5-6 drops onto the pad for a 2X2 area. Spread across working area before turning on buffer. Mantain a slow tempo and arm speed. Do not overwork product until dry. Keep surface area lubricated with compound.