Xilinx Field Programmable Gate Array - FPGA - part # XC3S1200E-4FT256C

Xilinx Field Programmable Gate Array - FPGA - part # XC3S1200E-4FT256C   Features • Very low-cost, high-performance logic solution for high-volume, consumer-oriented applications • Proven advanced 90-nanometer process technology • Multi-voltage, multi-standard SelectIO™ interface pins • Up to 376 I/O pins or 156 differential signal pairs • LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling • 622+ Mb/s data transfer rate per I/O • True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O • Enhanced Double Data Rate (DDR) support • DDR SDRAM support up to 333 Mb/s • Abundant, flexible logic resources • Densities up to 33,192 logic cells, including optional shift register or distributed RAM support • Efficient wide multiplexers, wide logic • Fast look-ahead carry logic • Enhanced 18 x 18 multipliers with optional pipeline • IEEE 1149.1/1532 JTAG programming/debug port • Hierarchical SelectRAM™ memory architecture  • Up to 648 Kbits of fast block RAM • Up to 231 Kbits of efficient distributed RAM • Up to eight Digital Clock Managers (DCMs) • Clock skew elimination (delay locked loop) • Frequency synthesis, multiplication, division • High-resolution phase shifting • Wide frequency range (5 MHz to over 300 MHz) • Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing • Configuration interface to industry-standard PROMs • Low-cost, space-saving SPI serial Flash PROM • x8 or x8/x16 parallel NOR Flash PROM • Low-cost Xilinx® Platform Flash with JTAG • Complete Xilinx ISE® and WebPACK™ software • MicroBlaze™ and PicoBlaze embedded processor cores • Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices) • Low-cost QFP and BGA packaging options • Common footprints support easy density migration • Pb-free packaging options • XA Automotive version available   XLX:XC3S1200E-4FT256C XC3S1200E-4FT256C