G6E-TSHV High Thermally Conductive , Non-Electrically Conductive Epoxy

Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSHV™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSHV™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromisin