The Mechanics of Solder Alloy Interconnects by John H. Lau, Steven N. Burchett,

Item specifics Condition: Like New :  Seller Notes: “Minor identifying marks on inside cover page shown in photos.” Language: English ISBN: 9780442015053 About this product Product Information The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer. Product Identifiers Publisher Springer ISBN-10 0442015054 ISBN-13 9780442015053 eBay Product ID (ePID) 997790 Product Key Features Format Hardcover Publication Year 1994 Language English Dimensions Weight 62.8 Oz Width 6in. Length 9in. Additional Product Features Number of Volumes 1 Vol. Dewey