Tecbond 263 Polypropylene Bonding Hot Melt
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Business & Industrial / Automation Control Components

Tecbond 263 Polypropylene Bonding Hot Melt

$120.00
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Power Adhesives Tecbond 263 Hot Melt Adhesive There are general-purpose hot melt formulations and there are formulations created to do a very specific job. Tecbond 263 is one of the latter, created specifically for bonding polypropylene (PP) substrates.  Along with this polypropylene bonding superpower, Tecbond 263 glue sticks offer great heat resistance as well as low-temperature performance and flexibility.  Glue Sticks Per Carton 11 lbs of glue stick size 1/2" x 12" is approximately 165 glue sticks Specifications Suggested application temperature: 375-400ºF Brooksfield viscosity (POW-12-VISC) spindle 27: 10,000cps @ 350ºF Ring & ball softening point (ASTM E28): 235ºF Heat resistance (BS5350 Part H3): 221ºF Open time: Medium Low-temperature flexibility (tg): -4ºF Tecbond 263 Polypropylene Glue Stick Resources Tecbond 263 TDS Tecbond 263 SDS

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