BGA-4 Breakout Board (1.04 x 1.07 mm, 0.5 mm)

This is a breakout board that was designed to be a DIP adapter for the BGA-4 type SMD packages. This board will require a re-flow oven or hot air gun to solder the part on the board. Technical Details Footprint Dimensions Body (mm): 1.04 x 1.07 Pitch (mm): 0.5 Thermal Pad (mm): n/a Breakout Board Dimensions Board Dimensions (mil): 450 x 370 Board Thickness (mil): 62 Through-Hole Spacing (mil): 300 mil (X-axis) 100 mil (Y-axis) Breakout Board Specifications Board Layers: 2 Finish: Immersion Gold Copper: 1 oz Traces (mil) 10 Trace Lengths (mil): <200 Pin/Through-Hole Count: 4 What's Included? Parts Installed on Board: None Parts Included (but not installed): 4 PIN Break Away Header (Straight) Additional Features Easily identifiable PIN 1 indicator and PIN numbers White silk “Label Pads” allow you to label the pins for quick reference Extended through-hole pads make for an easy connection point for surface mount parts Breadboard friendly pin spacing All boards have been E-tested for failures and are RoHS compliant …More details on our additional features can be found HERE Documentation Datasheet (PDF) Dimension Document (PDF)  (includes a 1:1 Scale Image of the board to ensure that it will be a good fit for your project!)