Amtech SynTECH-LF TF

Technical Data Sheet     Safety Data Sheet  Amtech SynTech-LF-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. Amtech SynTECH-LF-TF may be used for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.  Product Highlights  ROL0 flux classification  Wide process window  Excellent wetting compatibility on most board finishes  Clear residue  Low voiding  REACH compliant  Compatible Alloys  Alloy  Temp °C  Temp °F  42Sn/58Bi  138  280  42Sn/57Bi/1Ag  138  280  96.5Sn/3.0Ag/0.5Cu  217-220  423-428  99.0Sn/0.3Ag/0.7Cu  217-221  423-430  96.5Sn/3.5Ag  221  430  99.3Sn/0.7Cu  227  441  95Sn/5Sb  235-240  455-464  95Sn/5Ag  221-245  430-473  Test Results  Test J-STD-004 or  other requirements (as stated)  Test Requirement  Result  Copper Mirror  IPC-TM-650: 2.3.32  L: No breakthrough