ZB-S800 High-Precision 3D SPI Solder Paste Inspection Machine | Automated SMT Printing Quality Control System
Advanced 3D Solder Paste Inspection for Accurate Volume, Height, and Offset Measurement – Improve Yield and Reduce Defects The 3D SPI Solder Paste Inspection Machine ZB-S800 is an advanced inline inspection system designed to accurately measure solder paste volume, height, and position on PCBs. Using Phase Measuring Profilometry(PMP) imaging technology and high-resolution cameras, it helps you identify and eliminate printing defects early by inspecting the solder paste printing results before component placement. This prevents the costly waste of PCBs andcomponents, reduces rework rates, and dramatically improves overall First Pass Yield (FPY). And it supports data traceability for intelligent SMT manufacturing. It is an indispensable tool for modern, high-reliability electronics production. Al-Driven IntelligenceAdvanced Al software algorithms ensureultra-high detection accuracy and stabilityminimizing false calls and escaping. True 3D Measurement AccuracyUtilizes Phase Measuri