Koch Chemie Micro Cut Pad

Micro Cut Pad High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety. 150 x 23 mm 126 x 23 mm 76 x 23 mm  Compression hardness: 10 Abrasiveness: 5 100% PRICE MATCH GUARANTEE Free shipping on all orders over $200 in domestic the United States. Orders under $200 are charged $5 flat rate shipping. Same-day shipping before 2 pm Eastern time All orders ship through UPS Ground and U