DiaSec Diamond Wafering Blade - General Purpose Metallography 4in

DiaSec Diamond Wafering Blade - General Purpose Metallography 4in

$135.00
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The DiaSec General Purpose Diamond Blade is a must-have for metallurgical sample preparation. Made with metal bonding, this 4in x 0.016in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni-alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert.Diameter: 4in (100mm)Thickness: 0.016in (0.4mm)Arbor: 0.5in (12.7mm)Item No DS-10041/pkg

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$120 $135 (+$15)