DiaSec Diamond Wafering Blade - General Purpose Metallography 5in
$155.00
{{option.name}}:
{{selected_options[option.position]}}
{{value_obj.value}}
The DiaSec General Purpose Diamond Blade is a great choice for metallurgical sample sectioning. Made with metal bonding, this 5in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni-alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 5in (125mm)Thickness: 0.020in (0.5mm)Arbor: 0.5in (12.7mm) Item No DS-10051/pkg
Show More
Show Less
Price History
$140.01
$155
(+$14.99)