QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582
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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582

$15.40
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Product introduction:QianLi Toolplus Black stencil makes positioning your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil.Details:DESIGN - Designed to help with repairsDURABLE - Easy to work withSIZE - Standard size3D - Better positioning Product Features:1.Square hole technology2.Toughness, high temperature resistance and deformation3.New upgrade and revision4.Integrated steel mesh each network with CPU upper and lower layers5.Stepped groove design enables stencil to align with tinning position of ic rapidly.The square holes design makes it easier to take out the formed solder balls. High success rate of planting tin,the solder balls can be formed once afer you are proficient.

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