WYLIE BGA Reballing Stencil for iPhone 5/5S/6/6S/7/8 Plus/X/XR/XS 11 12 Pro Max Baseband CPU RAM Nand WiFi Power IC Chip Tin Net

PRODUCT INTRODUCTION WYLIE mobile phone tin planting steel netting tin planting netting square hole tin planting steel netting square hole tin planting net PRODUCT FEATURES Material imported from Japan, square hole processIntegrated network thickness 0.12㎜ 4 in 1 hard disk network thickness 0.2㎜New upgrade and revision Every integrated network has CPU upper and lower layersFull of toughness, high temperature resistance and deformationSuitable for 5/5c/5s/6/6p/6s/6sp/7/7p/8/8p/X/xs/xs max/xr/11/Pro/max/12/12mini/12Pro/max motherboard LCD screenWYLIE square hole tin planting steel mesh patent number: 201720095938.5