Maven EAF110 GEL Flexible & Thick Gel Epoxy Thixotropic - Medium Set 20 minute - Flexible Temp Resistant 20-Minute Set Plastic & Metal Epoxy

Maven EAF110 GEL is a two-part, room temperature cure, thixotropic thick epoxy gel adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It is especially formulated for a 1:1 mix ratio for use in side by side cartridges, or to be used by hand mixing, or use with Meter Mix Equipment. Substitutes and Similar Formulas: 3M DP110NS Flexible Non-Sag 20-minute set epoxy A handling cure is normally achieved at room temperature within 60 minutes with a full cure at room temperature within 24 hours. To accelerate the final cure, or to quicken the handling simply elevate the temperature.   Room Temperature Cure Properties Work Time: 8 to 12 minutes (at 75°F/ 24°C) Fixture Time: 60 minutes (at 75°F/ 24°C) Full Cure: 24 hours for full properties Operating Temperature -40°F(-40°C ) to 266°F (130°C) Mixed Density 9.5 lbs/