LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover

For removing chip glue and layering PCB boards, the Luowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate is ideal. The 65mm*100mm Luowei HS3 99W constant temperature control preheating platform is ideal for tinning, degumming, laminating, and other processes on a variety of mobile phone motherboards. Features: 1. Material composition: composed of aluminium alloy used in aircraft. It guarantees effective heating coverage in addition to increasing durability. 2. Three-level insulation design: reduces heat loss and helps maintain the ideal temperature. greater performance during maintenance and increased energy efficiency. 3. Uniform heating: To avoid damaging delicate components when doing maintenance, a steady heat distribution is necessary. 4. Numerous applications: Ideal for jobs like temperature control, degumming, tinning, lamination, and motherboard layers, among others. 5. Effective and portable: Compact and lightweight. robust operation and accurate temperature regulation. 6. Easy to use: Able to display the device's status based on colour shifts. 7. Quick heating: 99W maximum power. No hot air gun soldering iron is required. heating uniformly. Package List: 1 x Platform. 1 x Cable.