YCS-H03 Universal Mini Circular Fixture For Mobile Phone Motherboard Chip BGA Soldering Glue Removal Adjustable Repair Holder
$13.90
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YCS-H03 Universal Mini Circular Fixture For Mobile Phone Motherboard Chip BGA Soldering Glue Removal Adjustable Repair Holder YCS Ring Clamps YCS-H03 Features: Fully applicable to various types of chips/motherboards Removal tin and glue, no need to adjust direction, Travel coaxial movement iPhone Android Full Series IC Chip Removal Glue/Tin Not blocking the knife. Motherboard cleaning don't require adjusting orientation clean up at once. the module is suitable for various sizes of motherboards in all aspects. Product parameters: Brand:YCS Name:maintenance master circular Fixture Function:clamping various types of chips, motherboard, CPUs Net weight:211g Product size:104*22*90mm window.adminAccountId=231042464;
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