RESmap

Make Non-Contact Measurements of Low Resistivity Boules and Wafers with Unparalleled Repeatability   Si | Ge | compound semiconductors | wide bandgap | materials | metals | conductive | oxides & nitrides [Ge | Si | SiC |  InP | GaAs | GaN | InAs and more]   Features Contact free measurement and imaging of the resistivityHigh frequency eddy current sensing principle with integrated IR temperature sensor to correct for temperature variations of the sample Signal sensitivityHigh signal sensitivity, based on the coil frequency readout (patent pending), for accurate and reliable resistivity measurements with high reproducibility and repeatability Measurement time< 3s for the measurement and < 1s between measurements Measurement speed< 30s for a 200 mm wafer/ingot, 9 points Multi points measurement and mapping displaywith maximum 9999 points Material form factorFlat or slightly curved wafers, boules, ingots slabs, blanks and thin films X-Y placement resol