C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing

This Standard will provide a guide for consistent measurements and reporting measurement conditions of density of chemical mechanical planarization (CMP) pads. This Standard recommends using additional metrologies for measurements of CMP pad density, such as liquid or gas pycnometer metrologies. This Standard does not recommend stopping reporting density parameters using industry traditional metrology based on determining the weight and geometry of the pads (‘geometric parameters’). This Standard will provide a guide for consistent measurements and reporting of porosity of CMP pads. This Standard recommends using additional metrologies for measurements of CMP pad porosity, such as mercury or gas porosimetry. This Standard does not recommend stopping reporting porosity parameters using industry traditional pore count metrology based on scanning electron microscopy (SEM) or optical metrologies. This Standard will provide references to industry standards for measurements using well-establ