Chiplet and Heterogenous Integration Asia 2/2/26

Chiplet & Heterogeneous Integration for Microelectronics Packaging   Dates & Times   February 2nd, 2026  8:00 AM - 5:00 PM GMT +8   Location Webinar    Pricing Members: $599 Non-Members: $649   This workshop reviews the need for the packaging solutions to meet the demand for digitalization through the artificial intelligence and the Internet of Things from urbanization, and sustainability to the industry. The course provides an overview of the fabrication process of IC carriers of leadframe, ceramics, substrate, and flex, and how they have to evolve to meet the heterogeneous integration. With these foundations, various stacking and integration technologies through wirebonding, flip chip, and 3D interconnect from the interconnect to the system level will be shared. Packaging innovation of TSV,  fan-in, fan-out wafer-level packaging, and its challenges will also be shared for chiplet and heterogeneous integration. It ends off by sharing the embedded technologies and the embedded