E10600 - SEMI E106 - 300 mm物理的インタフェースおよびキャリアに関するSEMIスタンダードオーバービューガイド

本スタンダードは，Global Physical Interfaces and Carriers Committeeで技術的に承認されている。現版は2010年4月30日，Global Audits and Reviews Subcommitteeにて発行が承認された。2010年6月にwww.semi.orgで入手可能となる。初版は2000年10月発行，前版は2004年11月発行。本文書は，SEMI PR6-0200がそのまま置き換えられたものである。   注意： 2010年，投票により本文書の撤回が承認された。   本文書は，300 mmキャリアと製造設備のユーザおよびサプライヤが300mmの物理的インタフェースおよびキャリアに関するSEMIスタンダードにおける複雑な相互依存を理解し，どのスタンダードがどの製品に適応されるかを判断するのに役立つように意図された。図1に示される通り，本スタンダード類は極めて相互の関連度が高く，複雑な依存関係を有し，かつ順序だった番号体系（時系列的に200mmスタンダードからの）を継承するものである。　Referenced SEMI StandardsSEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm WafersSEMI E10 — Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM)SEMI E15 — Specification for Tool Load PortSEMI E15.1 — Specification for 300 mm Tool Load PortSEMI E19 — Standard Mechanical Interface (SMIF)SEMI E19.4 — 200 mm Standard Mechanical Interface (SMIF)SEMI E21.1 — Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport StandardSEMI E22.1 — Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume StandardSEMI E23 — Specification for Cassette Transfer Parallel I/O InterfaceSEMI E25 — Cluster Tool Module Interface: Module Access GuidelineSEMI E26.1 — Radial Cluster Tool Footprint 300 mm StandardSEMI E45 — Test Method for the Determination of Inorganic Contamination from Minienvironments Using Vapor Phase Decomposition-Total Reflection X-Ray Spectroscopy (VPD-TXRF), VPD-Atomic Absorption Spectroscopy (VPD-AAS), or VPD/Inductively Coupled Plasma-Mass Spectrometry (VPD/ICP-MS)SEMI E46 — Test Method for the Determination of Organic Contamination from Minienvironments Using Ion Mobility Spectrometry (IMS)SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm WafersSEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer CarriersSEMI E62 — Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)SEMI E63 — Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) InterfaceSEMI E64 — Specification for 300 mm Cart to SEMI E15.1 Docking Interface PortSEMI E70 — Guide for Tool Accommodation ProcessSEMI E72 — Specification and Guide for 300 mm Equipment Footprint, Height, and WeightSEMI E82 — Specification for Interbay/Intrabay AMHS SEM (IBSEM)SEMI E83 — Specification for 300 mm PGV Mechanical Docking Flange SEMI E84 — Specification for Enhanced Carrier Handoff Parallel I/O Interface SEMI E85 — Specification for Physical AMHS Stocker to Interbay Transport System InteroperabilitySEMI E92 — Specification for 300 mm Light Weight and Compact Box Opener/Loader to Tool-Interoperability Standard (BOLTS/Light))SEMI E99 — The Carrier ID Reader/Writer Functional Standard: Specification of Concepts, Behavior, and ServicesSEMI E99.1 — Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer Functional StandardSEMI E100 — Specification for a Reticle SMIF Pod (RSP) Used to Transport and Store 6 Inch or 230 mm ReticlesSEMI E101 — Guide for EFEM Functional Structure ModelSEMI E103 — Provisional Mechanical Specification for a 300 mm Single-Wafer Box System that Emulates a FOUPSEMI G74 — Specification for Tape Frame for 300 mm WafersSEMI G77 — Specification for Frame Cassette for 300 mm WafersSEMI M1.15 — Standard for 300 mm Polished Monocrystalline Silicon Wafers (Notched)SEMI M8 — Specification for Polished Monocrystalline Silicon Test WafersSEMI M28 — Specifications for Developmental 300 mm Diameter Polished Single Crystal Silicon WafersSEMI M29 — Specification for 300 mm Shipping BoxSEMI M31 — Provisional Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm WafersSEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmentSEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing EquipmentSEMI S11 — Environmental, Safety, and Health Guidelines for Semiconductor Manufacturing Equipment Minienvironments