Flexible & Printed Electronics Bundle
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Electronics / Components

Flexible & Printed Electronics Bundle

$580.00
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Course Description  This bundle consists of seven courses.  In this bundle will cover the following topics: 1. Flexible Power Sources: Challenges, Progress, and Integration, 2. Hybrid Integration Techniques for Flexible Electronics, 3. Flexible Batteries, 4. Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer 5. Packaging, Printing, Curing and Characterization Methods for Printable Conductors, 6. FHE for Medical & Industrial Application, 7.Next Generation of Printed Electronics. Electronics.  Topics covered include the following: Review challenges and programs for new power supplies, basics of battery terminology, chemistry and structures relevant to flexible electronics, how new packaging paradigms like chiplets and dielets are impacting flexible hybrid electronics (FHE), basics of using printable conductors for additive manufacture of circuits on polymer substrates, best-known methods for optimizing flexible electronics into medical devices and industrial products, and latest

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