G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1986; previously published in 1988.   NOTICE: This Document was reapproved with minor editorial changes.   The purpose of this test is to determine the thermal resistance of ceramic packages using thermal test chips. This test method deals only with junction-to-case or mounting surface measurements of thermal resistance and limits itself to heat sink and fluid bath testing environments. Following the guidelines outlined in this test method, junction-to-case thermal resistance measurements of ceramic packages using the heat sink and fluid bath methods should give the same results only under certain limited conditions (i.e., under conditions that approximate unidirectional heat flow through the chip