G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
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This specification defines the standard requirements for co-fired ceramic fine pitch chip carrier constructions, including both top brazed leaded and top metallized leadless configurations. These constructions are for hermetic packaging of various devices, (e.g., high speed, digital VLSI silicon devices), and next-level interconnection to printed wiring assemblies and modules by either lead solder attachment or by "leads last" techniques.　Referenced SEMI StandardsNone.
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