G10100 - SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging

Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances.The characteristics of encapsulation materials such as modulus needs to be recognized and defined to enable the qualified encapsulation processes for large panel size.This Specification focuses on the modulus of encapsulation material used in the manufacturing of WLP and PLP processes.This methodology is defined by 3-point bend test method to measure modulus.Referenced SEMI Standards (purchase separately)SEMI G83 — Specification for Bar Code Marking of Product PackagesRevision HistorySEMI G101-1122 (first published)