MF153000 - SEMI MF1530 - Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning

 1  Purpose1.1  Flatness, thickness and thickness variation are vital factors affecting the yield of semiconductor device processing.1.2  Knowledge of these characteristics can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements.1.3  This Test Method is suitable for measuring the flatness and thickness of wafers used in semiconductor device processing in the as-sliced, lapped, etched, polished, epitaxial or other layer condition.2  Scope2.1  This Test Method covers a noncontacting, nondestructive procedure to determine the thickness and flatness of clean, dry, semiconductor wafers in such a way that no physical reference is required.2.2  This Test Method is applicable to wafers 50 mm or larger in diameter, and 100 µm (0.004 in.) approximately and larger in thickness, independent of thickness variation and surface finish, and of wafer shape.2.3  This Test Method measures the flatness of the front wafer su