P02300 - SEMI P23 - Guidelines for Programmed Defect Masks and Benchmark Procedures for Sensitivity Analysis of Mask Defect Inspection Systems

This standard was technically approved by the global Micropatterning Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on September 5, 2007. It was available at www.semi.org in October 2007. Originally published in 1993; previously published in February 2000.   NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. 　 The purpose of this guideline is to propose a test mask to be used for evaluation of the sensitivity of Mask Defect Inspection Systems. This test mask consists of test chips including programmed pattern defects and reference test chips without programmed defects. Since the test chip is an assembly of cells, the test chips are defined in this guideline by cell patterns, programmed defects in cell patterns, and the layout of the cells. Also, the test ma