AIM NC258-SAC305-T3 Lead Free No Clean Solder Paste, 500 Gram Jar

AIM NC258-SAC305-T3 is a lead-free, no-clean solder paste formulated to provide exceptional print definition and superior wetting. Designed for high-speed stencil printing and excellent solderability across a variety of surfaces, NC258 delivers consistent performance for SMT assembly operations. This T3 particle size paste is well-suited for standard pitch applications, offering excellent print quality, low voiding, and easy cleaning—although cleaning is typically not required due to its no-clean formulation. Features: SAC305 Lead-Free Alloy (Sn96.5/Ag3.0/Cu0.5) T3 Particle Size for standard SMT applications Excellent printability and slump resistance Wide process window Outstanding wetting on various metallizations No-clean, low-residue flux system RoHS compliant Specifications: Manufacturer: AIM Solder Alloy: SAC305 (96.5% Sn / 3.0% Ag / 0.5% Cu) Flux Type: NC258 (No Clean) Particle Size: T3 Packaging: 500 Gram Jar Shelf Life: 1 year refrigerated (0–10°C) Applications: Sur