AIM M8-REL61-T4 No Clean Lead Free Solder Paste , 500 Gram Jar

AIM M8-REL61 No-Clean Solder Paste is engineered for the most demanding, high-density electronic assemblies, offering exceptional performance and reliability. An evolution of the highly successful NC258 platform, M8 takes no-clean solder paste technology to the next level. Designed for T4 and finer mesh lead-free alloy powders, M8 ensures stable transfer efficiencies that meet the challenges of today’s complex applications. The novel activator system in M8 provides powerful, durable wetting action, ensuring compatibility with a wide range of profiling processes and techniques. Designed to reduce HiP defects on BGA components and minimize voiding on QFN/BTC components, M8 delivers bright, shiny solder joints that meet the highest standards of quality and performance. The paste leaves minimal, high-purity residue, which is safe to remain in place, and can be easily coated or removed when necessary. Formulated with AIM’s REL61™ lead-free solder alloy, this solder paste delivers superior t