MT-063 T3-T6 - Sn63Pb37 no-clean mid-temp eutectic solder paste (REL0)

MT-063 - Sn63Pb37 no-clean mid-temperature solder paste (REL0) Resin-based low-activity REL0 (No-clean) World-class printability, instant activity response Halide-free. Passes BONO test. Ultra-Low voiding. Clear residue. Optimal viscosity. REACH-complaint Superior dispensing flow, stellar stencil printing, excellent pin transfer. Sharp definition at high-speeds. Low solder balling and graping. Long stencil life Easy to clean using IPA, solvents, water-based saponifiers, vapor degreaser or ultrasonic devices. Sn63Pb37 soldering paste for SMD assemblies conforming to space exploration and defense contractors specs. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 183C (Eutectic). Powder composition: 63% Tin, 37% Lead. Made with MT-TF no-clean soldering tacky paste flux High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a translucent body of synthetic resin-based solderin