OEM-NIG-TF no-clean rosin-based lead-free tacky paste flux (ROL0)

NIG-TF is a no-clean rosin-based tacky paste flux best suitable for soldering lead-free alloys Sn96.5Ag3.0Cu0.5, Sn96.5Ag3.5, Sn99.3Cu0.7, Sn99Ag0.3Cu0.7 to ENIG PCBs and Ni/Au finishing. NIG-TF is a traceable version of OEM 56L-TF includes QC-Aid for immediate visual PCB cleaning certification in UV/Blacklight – ROL0 flux classification - no-clean– Fine-tuned for Lead-free applications– More activity for lead-free alloys– Excellent wetting compatibility on most board finishes– Clear residue; Doesn’t short components– Wide process window – continue where you left off at a later time, once heated the flux will flow again Product keynotes – Rosin-based, more activity no-clean tacky solder flux best when used for operations with lead-free alloys and high-pitch solder powder in Medical Electronics and LED/Solar Industries, SAC alloys. – Excellent tackiness – holds components in place, clear residue. – Low viscosity – 20-48 (Malcom @ 10 RPM/25°C (x103mPa/s)) - easily flows under IC chips. H