RMA-042 T3-T6 - Sn42Bi58 low-temperature no-clean eutectic rosin mildly active solder paste (ROL0)

Low-temp solder paste for electronics assembly using rosin mildly activated LT solder flux Used for attachment of temperature-sensitive components to printed circuit boards, step soldering, warpage prevention, flexible circuits and large area array devices. Delivers reliable solder connections with low-temperature reflow. Solders low-Tg flexible boards and circuits used in phones, wearables and IoT devices Low-temp BGA paste reduces HIP (head-in-pillow) and NWO (non-wet-open) defects to minimum.