RMA-HT-010 T3 - Sn10Pb88Ag2 high-temp no-clean rosin mildly activated solder paste 2% silver (ROL0)

RMA-HT-010 is a rosin mildly activated high-temperature solder paste made using Sn10Pb88Ag2 alloy melting at 290ºC. Formulated with mild activity rosin and increased solids content, this paste withstands reflow at 350ºC for 5 minutes or longer - suitable for semiconductors attachment and multi-step PCB assembly. HT series increase speed and productivity for Hot Air rework under 380-480ºC with its specific fire-retardant properties HT flux maintains efficiency and clarity for extended period of time requiring minimum top-ups!