RMA-MA-063 T3-T6 - Sn63Pb37 more activity no-clean mid-range rosin mildly activated pin-testable eutectic solder paste (ROL1)

RMA-MA-063 - more activity no-clean mid-range pin-testable rosin mildly activated solder paste (ROL1) Sn63Pb37 eutectic alloy. - RMA Sn63Pb37 solder paste for SMD assemblies. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 183ºC (Eutectic). Powder composition: 63% Tin, 37% Lead. Alloy melting point - 183ºC. - High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RMA soldering tacky paste flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air. - RMA solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a soldering iron. - Contains QC-Aid special optical tracer glowing in UV for immediate visual QC certification - paste will glow in UV highlighting applicable areas. QC-Aid - Everyone Can QC! - Factory-made in the USA using certified conflict-free solder powder traced back to original alloy smelters. Supplied in an industrial air-syringes designed for pneumatic dispensers, supplemented with FREE snuggly fitting manual plunger and blunt dispensing tips.