RMA-LF-PRO-305 T3-T6 - Sn96.5.Ag3.Cu0.5 lead-free high activity rosin mildly activated solder paste 3% silver SAC305 (ROM1)

RMA-LF-PRO-305 - Sn96.5.Ag3.Cu0.5 lead-free high activity rosin mildly activated solder paste 3% silver (ROM1) High activity Sn96.5Ag3.0Cu0.5 soldering paste for SMD assemblies. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 219ºC. Powder composition: 96.5% Tin, 3% Silver, 0.5% Copper. Made using RMA-LF-PRO-TF soldering tacky paste flux. High-quality lead-free SAC305 solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RMA soldering tacky flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA, Hot Air or vapor degreaser. RMA-LF-PRO solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a solder iron. Essential for