RMA-MT-PRO-062 T3-T6 - Sn62Pb36Ag2 high-activity no-clean mid-temp rosin mildly activated eutectic solder paste 2% Silver (ROM1)

RMA-Mtº-PRO-062 - Sn62Pb36Ag2 high-activity no-clean mid-temp rosin mildly activated eutectic solder paste 2% Silver (ROM1) - High activity RMA Sn62Pb36Ag2 solder paste for SMD assemblies conforming to space exploration and defense contractors specifications. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 183ºC (Eutectic). Powder composition: 62% Tin, 36% Lead, 2% Silver - High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RMA soldering tacky paste flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air. - RMA solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a soldering ir