RMA-MT-PRO-063 T3-T6 - Sn63Pb37 more activity no-clean mid-range rosin mildly activated eutectic solder paste (ROM1)

RMA-Mt-PRO 063 - Sn63Pb37 high activity mid-temperature rosin mildly activated solder paste (ROM1) - High activity RMA Sn63Pb37 solder paste for SMD assemblies conforming to space exploration and defense contractors specifications. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 183ºC (Eutectic). Powder composition: 63% Tin, 37% Lead. - High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RMA soldering tacky paste flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air. - RMA solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a soldering iron. - Contains QC-Aid special optical