BGA-TF specialty no-clean tacky flux for BGA soldering (ROL0)

STIRRI-BGA-TF specialty no-clean universal tacky flux (ROL0) provides reliable soldering of BGA components, featuring BGA-balanced viscosity with an increased amount of solids. Specifically designed for BGA purposes, it addresses BGA slumping issues. However, despite its primary focus on BGAs, the flux can adequately perform also for any other soldering task, including leaded or unleaded hand-soldering with hot-air or machine soldering. BGA solder sphere slumping is a defect that occurs during the reflow soldering process, where the solder spheres deform and spread out, resulting in poor solder joint formation. This can lead to various issues, including: Poor electrical connection: The spread-out solder spheres may not adequately contact the BGA pads, leading to increased resistance and potential electrical failures. Mechanical weakness: The reduced solder volume can weaken the joint, making it more susceptible to mechanical stress and vibration. Thermal fatigue: The non-ideal sold