VS-UHF-305 T3-T6 - Sn96.5Ag3.0Cu0.5 lead-free halogen-free ultra-low-voiding no-clean rosin solder paste 3% silver SAC305 (ROL0)

STIRRI VS-UHF 305 - Sn96.5Ag3.0Cu0.5 no-clean lead-free ultra-low-voiding ZERO halogen rosin solder paste 3% silver (ROL0) SAC305 - IPC designation: ROL0 (no-clean). - REACH-complaint LGA, BGA, CSP assembly. - Halogen-free per EN14582 method - ZERO-Halogen. - Ultra-Low voiding. Clear residue. Optimal viscosity. - Superior dispensing, stencil printing, pin transfer. Sharp definition at high-speeds. - Universal for most PCB finishes. Long stencil life - Easy to clean using IPA, solvents, water-based saponifiers, vapor degreaser or ultrasonic devices