V2-062 T3-T6 - Sn62Pb36Ag2 no-clean mid-temp leaded eutectic solder paste 2% Silver (ROL0)

V2-062 Sn62Pb36Ag2 no-clean mid-temp low voiding leaded eutectic solder paste 2% Silver (ROL0) Sn62Pb36Ag2 soldering paste for SMT assemblies conforming to space exploration and defense contractors specs. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 179ºC (Eutectic). Powder composition: 62% Tin, 36% Lead, 2% Silver. Made with MT-TF no-clean soldering tacky paste flux High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a translucent body of rosin soldering tacky flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air STIRRI-MT solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a solder iron. Essential for leaded