10CC PCB BGA Soldering Paste Flux Phone BGA Solder Ball Flux Paste

JingLiang Lead-Free Soldering Materials 10CC PCB BGA Soldering Paste Flux, JL-300 10CC BGA Solder Paste Flux for Soldering and reballing of computer and phone chips. The BGA Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.Features:1. No-Clean solder paste flux for welding cell phone PCB SMD etc.2. Help to repair the circuit boards and protect the electronic components.3. A necessary material for repairing the mobile phone mainboard4. BGA soldering paste flux is the mixture of high-quality alloyed powder and resinic pasty flux.5. It can be used for soldering and reballing of computer and phone chips.6. Usage: Electronics / phone motherboard PC BGA soldering repairNote: Solder paste flux, liquid and rosin can only be sent by special post mail.Usage:Phone motherboard repairPC BGAElectronics welding, soldering