AMAO Xiaomi Mobile phone All Series BGA Reballing Stencil Template
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AMAO Xiaomi Mobile phone All Series BGA Reballing Stencil Template

$2.50
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AMAO multi-purpose Xiaomi Mobile phone All Series universal BGA Stencil Templates for Xiaomi motherboard BGA IC reballing soldering repair, AMAOE BGA reballing stencil MI:1 to MI:19 steel mesh for XIAOMI CPU Nand Flash IC tin planting soldering repair. AMAOE Xiaomi Mi Redmi Note Series Steel Mesh 0.12mm bga reballing stencil for Xiaomi Redmi Note Mi IC soldering repair.Model: MI:1 for MSM8998 CPU, Xiaomi 6 Series, MIX2, ect.MI:2 for MSM8974/8274/8674 CPU, Xiaomi 4 Series, MI3/3STE, ect.MI:3 for MSM8916/8928/MT6592 CPU, Xiaomi Redmi Note, Redmi2/2A, ect.MI:4 for MSM8956/MT6795 CPU, Redmi Note 2/3, xiaomi MAX, ect.MI:5 for MSM8953/MT6797 CPU, Redmi Note4/4X, Redmi Pro, ect.MI:6 for the Qualcomm Snapdragon 636/660 CPU, Redmi Note5TE5Pro，Xiaomi Note3/6X, ect.MI:7 for MSM8953/8917 CPU, Redmi Note 4X ,redmi4/4A/5A/5Plus/S2/Pro,xiaomi 5X/MAX2, ect.MI:8 for MSM8998 CPU, Xiaomi 5/5S/5s Plus/Note2/MIX, ect.MI:9 for the Qualcomm Snapdragon 845/710/SDM845/710 CPU, Xiaomi 8/8SE/MIX 2s, ect.MI:10 fo

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