BGA24 to DIP8 Flip Read Write Burn In Testing Socket

BGA24 to DIP8 flip Burn in sockets BGA25Q64 25PX32, BGA24 to DIP8 automobile chip read and write testing Burn in fixture, suitable for chip size: 6*8mm, with two pin matrices (4*6 and 5*5); two chips require different limit frames.Specifications:Product: BGA24 DIP8 6X8 mm adapter socketModel: BGA24Brand: DMPackage: BGA24pitch: 24mmApplicable IC Size: 6x8MM (6x4 and 5x5 array)Number of pins: 24Main body size: 4x6x3mmTotal size (including pins): 4x6x5mmApplicable scenarios:Electronic development/home appliance repair