Lead Free Solder Paste 217℃ 183℃ 138℃ Low Medium High Temperature
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Lead Free Solder Paste 217℃ 183℃ 138℃ Low Medium High Temperature

$2.85
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Mobile phone Motherboard Repair Professional BGA Solder Flux Paste, Medium Temperature 183℃ Sn62.8/Pb36.8/Ag0.4 / Low Temperature 138℃ Sn42/Bi58 / High Temperature Sn96.5/Ag3/Cu0.5 Lead Free Solder Paste, Net: Needle tube 42g / Canned 55g. Note:  Solder paste flux, liquid and rosin can only be sent by special post mail. Low Temperature (138℃):  1. Needle tube packaging: FIX-230 Sn42/Bi58 42g2. Canned package: FIX-231 Sn42/Bi58 55g Medium Temperature (183℃): 1: Syringe packaging: Needle tube  FIX-229 Sn62.8/Pb8/Ag0.4 42g2: Canned packaging: FIX-228 Sn62.8/Pb36.8/Ag0.4 55g High Temperature (217℃):1: Syringe packaging: Needle tube  FIX-227 Sn96.5/Ag3/Cu0.5 42g2: Canned packaging: FIX-226 Sn96.5/Ag3/Cu0.5 55gPeculiarities:1. With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering. 2. Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong. 3. Applicable to a variety of high-demand

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