Mechanic 3D BGA Reballing Stencil for Iphone 12 pro Layered Repair

Mechanic 3D-12 reballing stencil steel mesh for iPhone 12 Series  middle layer. Mechanic 3D middle layer stencils for iPhone 12/12 Pro/12 Pro Max/12 mini motherboard soldering repair. Option: 1. 3D-12 Pro: for iPhone 12/12 Pro motherboard middle layer frame.  2. 3D-12 mini: for iPhone 12 mini motherboard middle layer frame.  3. 3D-12 PM: for iPhone 12 Pro Max motherboard middle layer frame.  Product Features: 3D groove etching process: Universal material thickness 0.3mm groove etching thickness 0.15, reballing thickness 0.15mm. Take off the stencil to planting, prevent stencil from bulging. Square hole for planting stencil: The distance is exactly the same, and planting balls better. Round and full as a pearl: The tin ball bright, full and uniform. Imported with original packaging: Original imported T0.12AAA level material, good toughness, strong hardness, high temperature resistance 585℃, no bulge, high flatness, not easy to deformation. Double-sided positioning design: Tin planting on the upper and lower layers of the main board, degumming Product Specification : Item Name: 3D-12Pro Reballing Stencil Brand: Mechanic Model: 3D-12Pro (12 Pro A/B) Product Size: 77*35*0.12mm Packing Size: 95*63*14mm Net Weight: 6g