Mechanic 3D BGA Reballing Stencil Template Groove For IPhone X A12 PCB

Mechanic 3D stencil for iPhone X motherboard middle layer soldering repair. Mechanic 3D-X-PRO middle layer stencil with positioning base for iPhone X motherboard repair. Mechanic 3D Square Hole BGA Reballing Stencil steel mesh middle layer positioning tool for iPhone X A12.Option:1. 3D-X stencil only: for iPhone X.2. 3D-X Pro stencil with base: for iPhone XDescription:Mechanic 3D BGA Reballing Stencil for iPhone X Motherboard Middle Layer, iPhone X A12 PCB groove Reballing Stencil Template, New patented iPhone X Middle Layer Motherboard 3D BGA Reballing Stencil template, used for assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.Features:Made of high temperature resistant synthetic stone0.3mm thickness, easy to scrape tin, high strength, not easy to deformDurable, easier to take off the net, more efficientMini size, can put under microscope for use,easy to observe3D Design,stable use, precise plate tin